Backing Material: | Phenolic Butral Film |
Base Material: | Copper Foil |
Bonding Temperature: | 475°F |
Bonding Time: | 30 sec. |
Coating: | Tin/Lead Free |
Frame Size: | 2.25 x 1.5" |
Lead-Free Solder Compatible: | No |
Pad Length: | 0.100" |
Pad Width: | 0.012" |
Peel Strength: | 8 lb./in. |
Size: | .012” x .100” |