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- CircuitMedic CS025035AT BGA Pads Frame,.025"/.035"
CircuitMedic CS025035AT BGA Pads Frame,.025"/.035"
Product Description
Product Description
Frames are plated with .001” of 60/40 tin/lead. Specifications:
| Backing Material: | Phenolic Butral Film |
| Base Material: | Copper Foil |
| Bonding Temperature: | 475°F |
| Bonding Time: | 30 sec. |
| Coating: | Tin/Lead |
| Frame Size: | 2.25 x 1.5" |
| Lands Diameter: | 0.025, 0.035" |
| Lead-Free Solder Compatible: | No |
| Peel Strength: | 8 lb./in. |
| Size: | .025”/.035” |
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