Backing Material: | Phenolic Butral Film Adhesive |
Base Material: | Copper Foil |
Bonding Temperature: | 475°F |
Bonding Time: | 30 s |
Frame Size: | 2.25 x 1.50" |
Lead-Free Solder Compatible: | Yes |
Pad Length: | 0.110" |
Pad Width: | 0.045" |
Peel Strength: | 8 lb./in. |
Size: | .045” x .110” |